KLA CORP케이엘에이(KLA)

KLA Corporation, together with its subsidiaries, provides process control and process-enabling solutions for manufacturing wafers, reticles/masks, chemicals/materials, integrated circuits (ICs), packaged ICs, and printed circuit boards. It operates through three segments: Semiconductor Process Control; Specialty Semiconductor Process; and PCB and Component Inspection. The company offers inspection and review tools to identify, locate, characterize, review, and analyze defects on various surfaces of patterned and unpatterned wafers; chemical process control equipment; wired and wireless sensor wafers and reticles; wafer defect inspection, review, and metrology systems; reticle inspection and metrology systems; wafer inspection and metrology systems; semiconductor software solutions; KLA Pro systems; and specialty semiconductor manufacturing, benchtop metrology, surface characterization, material strength characterization, and electrical property measurement products. It also provides etch, plasma dicing, deposition and other wafer processing technologies and solutions; direct imaging, inspection, optical shaping, inkjet, and additive printing, as well as computer-aided manufacturing and engineering solutions; and components. In addition, the company offers service programs. It serves semiconductor, and semiconductor-related and electronic device manufacturers. The company operates in China, Taiwan, Korea, North America, Japan, Europe, Israel, and rest of Asia. The company was formerly known as KLA-Tencor Corporation and changed its name to KLA Corporation in July 2019. KLA Corporation was incorporated in 1975 and is headquartered in Milpitas, California.

KLA Corporation은 자회사들과 함께 전 세계 반도체 및 관련 전자 산업을 위한 공정 제어, 공정 지원 및 수율 관리 솔루션을 설계, 제조, 판매합니다. 이 회사는 Semiconductor Process Control 부문, Specialty Semiconductor Process 부문, 그리고 PCB and Component Inspection 부문의 세 가지 사업 부문으로 나뉘어 운영됩니다. 이 회사는 패턴이 형성된 웨이퍼와 패턴이 없는 웨이퍼의 다양한 표면에서 결함을 식별, 위치 파악, 특성화, 검토 및 분석하기 위한 검사 및 리뷰 도구와 웨이퍼의 패턴 치수, 박막 두께, 박막 응력, 층간 정렬, 패턴 배치, 표면 지형 및 전기 광학 특성을 측정하기 위한 계